Real Plasma (APG-500)
This plasma treater modifies the object’s surface to treat and remove organic substances by irradiating ionized gas in a plasma state. It generates the ionized gas inside its discharge nozzle by using high-frequency, high-voltage electric energy. Since plasma is almost neutral electrically, it does not electrically or thermally damage treated base materials. This means the treater can be used to treat the surface of sensitive materials such as printed wiring boards and liquid crystal panels. A wide variety of discharging heads for the Real Plasma APG-500 are available. Choose the one best suited to the workpiece or application to ensure that surface modification is conducted with the highest possible efficiency and effectiveness of plasma discharge.
Representative discharging head of Real Plasma APG-500
Specifications
| Supply voltage | Single phase, AC200V/220V, 50/60 Hz |
|---|---|
| Power consumption | 1000VA |
| Supply air volume | 200NL/min |
| Supply air pressure | 0.5MPa |
| Diameter of air supply port | One-touch air joint (φ10) |
| Treatment width | 24mm |
| Installation distance | 5-10 mm (between tip of nozzle and workpiece) |
| Frame temperature | 68°C (when measured with an alcohol thermometer for 2 minutes with Ta = 21°C) |
| Object to be treated | Plastic, glass, metals, semiconductors, electronic substrates |
| Dimensions | Oscillator AGF-B20: 250 mm × 180 mm × 300 mm |
| Plasma unit APG-500: 400 mm × 270 mm × 345 mm | |
| Plasma head PH-500: 320 mm × 63 mm × 106 mm | |
| Mass | Oscillator AGF-B20: 11 kg |
| Plasma unit APG-500: 8.9 kg | |
| Plasma head PH-500: 2.2 kg | |
| Operating environment | Temperature: 5°C - 40°C, Humidity: 17% - 70% RH (no condensation) |
Real Plasma system configuration (APG-500)
